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Home > Packaging, Weighing, Measuring & Franking > Identification System > SC6500P Wafer ID Reader | NIR light
SC6500P Wafer ID Reader | NIR light
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MV-SC6500P-AI-WID-IBN

Packaging, Weighing, Measuring & Franking

Identification System

Additional Information

Type
SC6500P Wafer ID Reader
Length (mm)
127
Height (mm)
49
Width (mm)
69
Operating Temperature (ยฐC)
0 to 50
Storage Temperature (ยฐC)
โ€“30 to 70
Image Resolution
1408 ร— 576
Power Consumption (W)
11.5
Weight(Grams)
829
Marketplace Benefits
Helpdesk Year-long Helpdesk
Verified Sellers Verified Sellers
Verified Payment Easy Payment
Warranty & Return Policy
Warranty Warranty Policy
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Description

MV-SC6500P-AI-WID-IBN

SC6500P Series Wafer ID Reader โ€“ Mono, Combined IR Light Source

The MV-SC6500P-AI-WID-IBN is a high-precision Wafer ID Reader developed specifically for semiconductor manufacturing environments requiring stable, repeatable, and ultra-high-accuracy wafer identification. It integrates advanced imaging, intelligent illumination, deep learning algorithms, and industrial-grade hardware into a compact, reliable platform ideal for wafer tracking, automation systems, and semiconductor process control.

Powered by the SC6500P architecture and equipped with the Vision Master Platform + SCClient, this device supports a wide range of wafer ID marking types, including SEMI-standard OCR characters, Data Matrix codes, 1D barcodes, and QR codes. Its Near-Infrared (NIR) combined LED light source significantly enhances contrast on challenging wafer surfaces, such as highly polished wafers, etched marks, laser-engraved IDs, and low-contrast characters.


Advanced Features & Benefits

1. High-Accuracy Wafer Identification

The device includes robust OCR and code-reading algorithms compatible with SEMI standards. It reliably reads:

SEMI OCR wafer characters

DataMatrix codes

QR codes

1D barcodes

Deep learning modules improve performance on difficult wafer marks, partial characters, reflective surfaces, and non-uniform illumination conditions.


2. Intelligent NIR Combined Lighting

The integrated Near-Infrared LED illumination offers superior performance compared to visible light in semiconductor environments.
Key advantages:

Enhances visibility of engraved, etched, or low-contrast wafer IDs

Reduces glare and reflections from smooth or mirror-finished wafers

Supports both bright-field and dark-field lighting methods

Fully configurable illumination intensity through software

This makes the device ideal for advanced wafer lines, including 200 mm and 300 mm wafer processing.


3. High-Speed Image Acquisition

The reader includes a CMOS global shutter sensor optimized for fast and stable imaging:

Resolution: 1408 ร— 576

Pixel size: 3.45 ยตm

Max frame rate: 120 fps

Exposure time: 25 ยตs to 1 s

Pixel format: Mono 8

The high-speed capture is ideal for integration into automated wafer handling arms, wafer sorting machines, FOUP/SMIF load ports, and inspection modules where throughput is critical.


4. Auto-Focus Optical System

Equipped with an M12 mount lens and intelligent auto-focus, the reader automatically adjusts to the optimal focus position to maintain imaging clarity across:

Different wafer thicknesses

Slight deviations in wafer position

Adjustable installation heights (40โ€“50 mm recommended)

This minimizes mechanical adjustments and simplifies integration into OEM semiconductor tools.


5. Strong Processing Platform

The SC6500P hardware platform provides:

8 GB memory

64 GB storage

Support for deep learning inference

Real-time data processing and communication

Fast algorithm execution for high-throughput wafer manufacturing lines


6. Industrial-Grade Interfaces

A wide range of industrial protocols ensures easy integration with semiconductor equipment:

TCP / UDP

MODBUS

Serial Port

PROFINET

EtherNet/IP

FINS

MC

FTP

The Gigabit Ethernet interface ensures fast data transfer and low-latency communication with host systems.


7. Compact, Durable Mechanical Design

Built for reliability in semiconductor facilities:

Ingress protection: IP40

Dimensions: 127 ร— 69 ร— 49 mm

Weight: 829 g

Humidity tolerance: 20โ€“95% RH (non-condensing)

Working temperature: 0โ€“40ยฐC

The rugged design ensures stable performance under cleanroom conditions and continuous operation in automated semiconductor equipment.


8. Efficient Power & I/O

Power supply: 24 VDC

Power consumption:

Typical: 11.5 W

Maximum: 18 W

Digital I/O:

Non-isolated input ร— 1

Non-isolated output ร— 1

RS-232 ร— 1


Typical Applications

Wafer ID reading for 200 mm / 300 mm wafers

Wafer sorting and classification stations

FOUP/SMIF load port identification

Track & trace across semiconductor production lines

Lithography, etching, CMP, deposition, and inspection tools

Semiconductor MES data binding and automation equipment


Why Choose MV-SC6500P-AI-WID-IBN?

Superior ID readability using NIR illumination

Faster, more reliable performance on difficult wafer surfaces

High-speed sensor for automation lines

Deep learning-enhanced accuracy

Compact industrial design

Flexible deployment with auto-focus

Seamless connectivity with major industrial protocols